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Senior 3D Integrated Chip Architecture Engineer

About the Company:

Quantum Futures has partnered with one of the leading superconducting quantum computing hardware companies that are looking for a Senior 3D Integrated Chip Architecture Engineer.

This role provides an exciting opportunity to devise state-of-the-art solutions that will advance their superconducting quantum computing architecture. 

Job Description:

In this position, you will focus on the design, fabrication and assembly of superconducting quantum devices, while contributing to setting up the cryogenic microwave measurements. Furthermore, you will collaborate with multidisciplinary teams to optimise device performance and troubleshoot assembly issues. Multiple locations in central Europe (including Germany, France and Netherlands). The roles are on-site, not remote. 

The ideal candidate will have significant experience in 3D architecture design, as well as in quantum chip assembly and microwave engineering. 


  • PhD in Electrical Engineering, Physics, or a related field.

  • Expertise in quantum assembly engineering, thin film technologies and micro-assembly processes.

  • Experience with microwave engineering and cryogenic measurements.

  • Proficiency in Python, Inventor and AutoCAD. 

Join the Team:

If you're interested, please apply below or contact Marietta Giannakakou at


€70,000 - €85,000

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